C25D 7/0671
Selective plating
Official title: {Selective plating}
C25D7/0671 (Selective plating) appears on 48 US grants and 37 published applications in this corpus.
Search patents in C25D- Granted patents
- 48
- Published applications
- 37
- Assignees
- 40
- Inventors
- 120
- Latest grant
- 22 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 0 | 0 |
| 2003 | 1 | 2 |
| 2004 | 0 | 2 |
| 2005 | 1 | 1 |
| 2006 | 1 | 1 |
| 2007 | 0 | 1 |
| 2008 | 0 | 1 |
| 2009 | 1 | 3 |
| 2010 | 1 | 1 |
| 2011 | 0 | 0 |
| 2012 | 3 | 1 |
| 2013 | 0 | 2 |
| 2014 | 0 | 1 |
| 2015 | 0 | 1 |
| 2016 | 1 | 6 |
| 2017 | 1 | 0 |
| 2018 | 2 | 1 |
| 2019 | 1 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 2 |
| 2022 | 1 | 2 |
| 2023 | 3 | 3 |
| 2024 | 2 | 1 |
| 2025 | 2 | 3 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Heat equalization plate22 Jul 2025US 12,369,275 B2Avary Holding (Shenzhen) Co., Limited.
- Carbon-nanotubes copper composite conductors6 May 2025US 12,293,853 B2Technion Research & Development Foundation Limited
- Methods and systems of forming metal interconnect layers using engineered templates10 Dec 2024US 12,165,881 B2
- Plasma treatments for flexures of hard disk drives29 Oct 2024US 12,129,567 B2Hutchinson Technology Incorporated
- Method for manufacturing an electrical contact part14 Nov 2023US 11,817,663 B2Auto-Kabel Management GmbH
- Carbon-nanotubes copper composite conductors28 Aug 2025US 2025/0273360 A1Technion Research & Development Foundation Limited
- Selective plating mask member and selective plating method20 Mar 2025US 2025/0092556 A1Dowa Metaltech Co., Ltd.
- Methods And Systems Of Forming Metal Interconnect Layers Using Engineered Templates27 Feb 2025US 2025/0069900 A1
- Hollow copper thermal conductors11 Jul 2024US 2024/0234859 A1GM Global Technology Operations LLC
- Methods and systems of forming metal interconnect layers using engineered templates16 Nov 2023US 2023/0369065 A1
Most cited
By later US patents
- Apparatus for intermitting electroplating strips36US 3,977,957 ANational Plastics & Plating Supply Co., Inc. · 1976
- Method and apparatus for electroplating a metallic deposit on interconnected metallic components and/or metallized products28US 4,770,754 AMeco Equipment Engineers B.V. · 1988
- Selective plating apparatus25US 3,951,772 AAuric Corporation · 1976
- Electroplating contacts of printed circuits16US 4,000,045 ABurroughs Corporation · 1976
- Electroplating selected portions of a strip15US 3,974,056 AAnn Arbor Circuits, Inc. · 1976