Electroplating contacts of printed circuits
AssigneeBurroughs Corporation
InventorRichard Ralph Rotzow
Life of this patent
Estimating the term…
Abstract
A printed-circuit board requiring precious metal electroplating of its contact finger areas is adapted for such plating by a temporarily affixed electroplating current carrier of metallic foil held in contact with other printed wiring interconnected with the contact finger areas. The metallic foil is shielded from contact with electroplating baths by a strip of dielectric plastic film, the film and the foil being temporarily held in a selected position on the board by a layer of non-setting pressure-sensitive adhesive.
Claims4
A method of electroplating selected printed wiring formed on a first region of a substrate while preventing electroplating of printed wiring formed on an adjacent second region of the substrate, said method comprising the steps of:
- forming the printed wiring on said first and second regions of said substrate so that said selected printed wiring on said first region which is to be electroplated is electrically connected to predetermined portions of the printed wiring on said second region which are not to be electroplated;
- positioning a removable shielding tape having a backing of insulative material coated with a non-setting pressure-sensitive insulative adhesive material and having an elongated conductor held on the tape by the adhesive over a second region of the substrate;
- said positioning of the tape and the path of said elongated conductor on said shielding tape being chosen so that said positioning brings said conductor into electrical contact with said predetermined portions of the printed wiring on said second region;
- rolling the substrate between resilient pressure rollers so as to press the shielding tape and its conductor against said second region of the substrate to form a seal which prevents seepage of liquid under the tape during electroplating, said conductor being located sufficiently spaced from the edges of the tape so as not to interfere with the formation of said seal and so as not to be electroplated;
- electroplating onto the selected printed wiring on said first region using said conductor for providing an electrical path for electroplating current to flow to said selected printed wiring via said predetermined portions of said second region;
- and
- removing the shielding tape along with its conductor after completion of electroplating.
Dependencies are inferred from the claim text.