Heat equalization plate

A heat equalization plate comprising:

• a first copper clad laminate comprising a first copper foil;
• a second copper clad laminate comprising a second copper foil facing the first copper foil;
• a connecting bump formed on a surface of the first copper foil facing the second copper foil, wherein the connecting bump comprises a second body portion and a second cover portion, the second body portion is electrically connected to the first copper foil, the second cover portion is electrically connected to a side of the second body portion facing away from the first copper foil, a width of the second cover portion is greater than a width of the second body portion to cover the whole side of the second body portion, and a periphery of the second cover portion protrudes from a periphery of the second body portion;
• a plurality of thermally conductive bumps formed on a surface of the first copper foil facing the second copper foil;
• and
• working fluid;
• wherein the connecting bump is an annulus and surrounds the plurality of thermally conductive bumps, the connecting bump is connected to the second copper foil to form a sealed chamber between the first copper foil and the second copper foil, the plurality of thermally conductive bumps is received in the sealed chamber, and the working fluid is received in the sealed chamber.