C25D 3/52
Characterised by the organic bath constituents used
Official title: characterised by the organic bath constituents used
C25D3/52 (Characterised by the organic bath constituents used) appears on 60 US grants and 33 published applications in this corpus.
Search patents in C25D- Granted patents
- 60
- Published applications
- 33
- Assignees
- 49
- Inventors
- 153
- Latest grant
- 21 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 4 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 5 | 0 |
| 1985 | 6 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 3 |
| 2004 | 2 | 1 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 2 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 2 |
| 2012 | 1 | 1 |
| 2013 | 1 | 2 |
| 2014 | 1 | 2 |
| 2015 | 0 | 3 |
| 2016 | 2 | 2 |
| 2017 | 2 | 3 |
| 2018 | 0 | 0 |
| 2019 | 2 | 0 |
| 2020 | 3 | 2 |
| 2021 | 0 | 2 |
| 2022 | 2 | 1 |
| 2023 | 0 | 2 |
| 2024 | 1 | 1 |
| 2025 | 2 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for recovering metal from waste printed circuit board and a cell thereof21 Oct 2025US 12,448,695 B2City University of Hong Kong
- Electroplating solutions14 Oct 2025US 12,442,099 B2Johnson Matthey Public Limited Company
- Bonding copper wire plated with palladium and gold and electroplating process thereof2 Jul 2024US 12,024,788 B1Shanghai Wonsung Alloy Material Co., Ltd.
- Metal or metal alloy deposition composition and plating compound29 Nov 2022US 11,512,405 B2Atotech Deutschland GmbH
- Coating surfaces with nanostructures16 Aug 2022US 11,414,761 B2Albert-Ludwigs-Universität Freiburg
- Electroplating solutions2 Oct 2025US 2025/0305175 A1Johnson Matthey Public Limited Company
- Leveling agent, composition, and application thereof3 Jul 2025US 2025/0215598 A1Fudan University
- Ruthenium Alloy Layer and Its Layer Combinations18 Jan 2024US 2024/0018679 A1Umicore Galvanotechnik GmbH
- Method for recovering metal from waste printed circuit board and a cell thereof28 Dec 2023US 2023/0416936 A1City University of Hong Kong
- Electroplating solutions21 Dec 2023US 2023/0407507 A1Johnson Matthey Public Limited Company
Most cited
By later US patents
- Acidic palladium strike bath37US 5,178,745 AAT&T Bell Laboratories · 1993
- Palladium alloy plating process36US 4,911,798 AAT&T Bell Laboratories · 1990
- Palladium-nickel alloy plating solution28US 5,342,504 AYazaki Corporation · 1994
- Precious metal deposition composition and process25US 6,251,249 B1Atofina Chemicals, Inc. · 2001
- Electrolyte for the galvanic deposition of low-stress, crack-resistant ruthenium layers21US 6,117,301 ADegussa-Huls AG · 2000