Palladium alloy plating process
AssigneeAT&T Bell Laboratories
InventorsJoseph A. Abys, Virginia T. Eckert, Catherine Wolowodiuk
Life of this patent
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Abstract
A process is described for electroplating palladium and palladium alloys. The process involves the use of an alkyl hydroxyamine as complexing agent and is particularly good for palladium alloys such as palladium-nickel and palladium-cobalt.
Claims11
A process for electroplating a metallic substance, said metallic substance comprising palladium, comprising the step of passing current through a cathode, an electroplating bath and an anode with cathode potential great enough to electroplate palladium, said electroplating bath having a conductivity greater than 10.sup.-3 mho-cm and a pH greater than 5 characterized in that the electroplating bath comprises palladium complex ion in which the complexing agent comprises alkylhydroxy amines selected from the group consisting of bis-(hydroxymethyl)aminomethane, tris-(hydroxymethyl)aminomethane, bis-(hydroxyethyl)aminomethane and tris-(hydroxyethyl)aminomethane.
Dependencies are inferred from the claim text.