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US 2023/0416936 A1Published application
Method for recovering metal from waste printed circuit board and a cell thereof
AssigneeCity University of Hong Kong
InventorChun Ho Lam
Life of this patent
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Abstract
A metal recovery device for recovering metal in a waste printed circuit board by way of electrodeposition including: a cathode, an anode, and an electrolyte in electrical communication with the cathode and the anode, wherein the electrolyte includes a glycol-based compound and a metal chloride. A method of preparing an electrolyte for use in the same. A method of metal recovery for recovering metal from waste printed circuit board by making use the same.
Claims37
A metal recovery device for recovering metal in a waste printed circuit board by way of electrodeposition comprising:
- a cathode,
- an anode, and
- an electrolyte in electrical communication with the cathode and the anode,
- wherein the electrolyte comprises a glycol-based compound and a metal chloride.
1 more element
Dependencies are inferred from the claim text.