C25D 17/004
Sealing devices
Official title: {Sealing devices}
C25D17/004 (Sealing devices) appears on 240 US grants and 290 published applications in this corpus.
Search patents in C25D- Granted patents
- 240
- Published applications
- 290
- Assignees
- 117
- Inventors
- 525
- Latest grant
- 28 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 0 |
| 2002 | 3 | 9 |
| 2003 | 3 | 6 |
| 2004 | 6 | 7 |
| 2005 | 4 | 9 |
| 2006 | 1 | 3 |
| 2007 | 3 | 6 |
| 2008 | 4 | 10 |
| 2009 | 2 | 7 |
| 2010 | 7 | 8 |
| 2011 | 11 | 8 |
| 2012 | 6 | 7 |
| 2013 | 3 | 12 |
| 2014 | 1 | 6 |
| 2015 | 4 | 14 |
| 2016 | 11 | 17 |
| 2017 | 9 | 20 |
| 2018 | 13 | 19 |
| 2019 | 17 | 17 |
| 2020 | 13 | 26 |
| 2021 | 17 | 14 |
| 2022 | 25 | 15 |
| 2023 | 16 | 13 |
| 2024 | 11 | 14 |
| 2025 | 12 | 12 |
| 2026 | 6 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate holder, substrate plating device equipped therewith, and electrical contact28 Apr 2026US 12,612,710 B2Ebara Corporation
- Plating apparatus and substrate cleaning method21 Apr 2026US 12,606,929 B2Ebara Corporation
- Semiconductor film plating perimeter mapping and compensation3 Mar 2026US 12,568,778 B2APPLIED Materials.Inc.
- Plating apparatus and plating method10 Feb 2026US 12,546,026 B2Ebara Corporation
- Film forming method for metal film6 Jan 2026US 12,516,436 B2Toyota Jidosha Kabushiki Kaisha
- Substrate holder, substrate plating device equipped therewith, and electrical contact30 Jul 2026US 2026/0218407 A1Ebara Corporation
- Electroplating apparatus23 Jul 2026US 2026/0209983 A1Samsung Electronics Co., Ltd.
- Plating apparatus and substrate cleaning method23 Jul 2026US 2026/0209984 A1Ebara Corporation
- Device for electrochemical surface treatment of an inner surface of a tubular member made of electrically conductive material, in particular a gun barrel, and system comprising such a device9 Jul 2026US 2026/0193806 A1Knds France Mechanics
- Semiconductor film plating perimeter mapping and compensation9 Jul 2026US 2026/0198236 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Electro-chemical deposition cell for face-up processing of single semiconductor substrates343US 6,416,647 B1APPLIED Materials.Inc. · 2002
- Clamshell apparatus for electrochemically treating wafers141US 6,800,187 B1Novellus Systems, Inc. · 2004
- Anodization apparatus with supporting device for substrate to be treated65US 5,458,755 ACanon Kabushiki Kaisha · 1995
- Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces65US 6,540,899 B2All Wet Technologies, Inc. · 2003
- Plating method and apparatus52US 4,401,522 AMicro-Plate, Inc. · 1983