Electroplating apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsSEUNGA CHOI, SUNGKEUN LEE
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AssigneeSamsung Electronics Co., Ltd.
InventorsSEUNGA CHOI, SUNGKEUN LEE
Estimating the term…
An electroplating apparatus including a plating bath containing a plating solution, and a substrate holder holding a substrate so as to immerse the substrate in the plating solution. The substrate holder includes a rotor supporting the substrate, a moving plate supporting the rotor, a support plate under the moving plate, at least three cylinders coupled to the support plate, each cylinder having a piston connected to a lower surface of the moving plate to move the moving plate up and down, shafts between the cylinders, coupled to an upper surface of the support plate, and extending in a direction vertical to the upper surface of the support plate, linear bushings coupled to a lower surface of the moving plate and corresponding to the shafts, and a sealing ring fixing the substrate onto the rotor. The shafts are inserted into guide holes vertically penetrating the moving plate and the linear bushings.
An electroplating apparatus comprising:
An electroplating apparatus comprising:
An electroplating apparatus comprising:
Dependencies are inferred from the claim text.