C23F 1/46
Regeneration of etching compositions
C23F1/46 (Regeneration of etching compositions) appears on 152 US grants and 70 published applications in this corpus.
Search patents in C23F- Granted patents
- 152
- Published applications
- 70
- Assignees
- 109
- Inventors
- 349
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 8 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 5 | 0 |
| 1982 | 4 | 0 |
| 1983 | 6 | 0 |
| 1984 | 4 | 0 |
| 1985 | 5 | 0 |
| 1986 | 7 | 0 |
| 1987 | 4 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 5 | 0 |
| 1991 | 7 | 0 |
| 1992 | 6 | 0 |
| 1993 | 10 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 0 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 0 |
| 2003 | 2 | 2 |
| 2004 | 2 | 2 |
| 2005 | 0 | 3 |
| 2006 | 1 | 2 |
| 2007 | 2 | 1 |
| 2008 | 0 | 1 |
| 2009 | 3 | 2 |
| 2010 | 0 | 2 |
| 2011 | 1 | 3 |
| 2012 | 2 | 0 |
| 2013 | 1 | 1 |
| 2014 | 1 | 6 |
| 2015 | 1 | 4 |
| 2016 | 5 | 3 |
| 2017 | 0 | 4 |
| 2018 | 1 | 2 |
| 2019 | 3 | 2 |
| 2020 | 4 | 2 |
| 2021 | 2 | 1 |
| 2022 | 1 | 7 |
| 2023 | 1 | 7 |
| 2024 | 2 | 4 |
| 2025 | 4 | 9 |
| 2026 | 4 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Solvent free copper extraction18 Aug 2026US 12,709,784 B2GreenSource Fabrication LLC
- Wastewater treatment system and method for semiconductor fabrication process14 Apr 2026US 12,599,874 B2Samsung Electronics Co., Ltd.
- Method for recovering chromium contained in a bath for pickling metallic materials and facility for implementing same17 Feb 2026US 12,553,109 B2Aperam
- Substrate processing apparatus and substrate processing method20 Jan 2026US 12,529,149 B2Semes Co., Ltd.
- Bowl, substrate processing apparatus, and method of manufacturing30 Dec 2025US 12,509,779 B2Semes Co., Ltd.
- Process for regenerating chemical milling solutions6 Nov 2025US 2025/0340998 A1Green Etching S.R.L.
- Method for electrolysis-assisted oxidative regeneration of alkaline copper-ammonia chloride etching working solution, and apparatus using same6 Nov 2025US 2025/0340999 A1
- Process for etching circuit board with alkaline tetraamminecopper (ii) sulfate and apparatus therefor18 Sep 2025US 2025/0290205 A1
- Semiconductor wafer treatment liquid containing hypochlorite ions and ph buffer14 Aug 2025US 2025/0257264 A1Tokuyama Corporation
- Lubricant for filtration containing onium ions24 Jul 2025US 2025/0235805 A1Tokuyama Corporation
Most cited
By later US patents
- Foldable scooter with head tube assembly, brake and suspension76US 6,234,501 B12001
- Recovery of gold and/or palladium from an iodide-iodine etching solution59US 4,319,923 AWestern Electric Company, Inc. · 1982
- Method and apparatus for etching copper47US 4,545,877 A1985
- System for maintaining uniform copper etching efficiency39US 3,964,956 AGeneral Dynamics Corporation · 1976
- Metal dissolution process using H.sub.2 O.sub.2 --H.sub.2 SO.sub.4 etchant39US 4,395,302 AEnthone Inc. · 1983