C22C 9/02
Alloys based on copper: with tin as the next major constituent
Official title: with tin as the next major constituent
C22C9/02 (Alloys based on copper: with tin as the next major constituent) appears on 422 US grants and 550 published applications in this corpus.
Search patents in C22C- Granted patents
- 422
- Published applications
- 550
- Assignees
- 259
- Inventors
- 1,128
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 4 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 6 | 0 |
| 2000 | 6 | 0 |
| 2001 | 8 | 8 |
| 2002 | 9 | 10 |
| 2003 | 6 | 24 |
| 2004 | 12 | 11 |
| 2005 | 3 | 6 |
| 2006 | 5 | 16 |
| 2007 | 6 | 9 |
| 2008 | 2 | 13 |
| 2009 | 5 | 29 |
| 2010 | 7 | 22 |
| 2011 | 9 | 20 |
| 2012 | 13 | 30 |
| 2013 | 11 | 35 |
| 2014 | 19 | 30 |
| 2015 | 18 | 31 |
| 2016 | 26 | 41 |
| 2017 | 27 | 36 |
| 2018 | 36 | 24 |
| 2019 | 38 | 42 |
| 2020 | 16 | 20 |
| 2021 | 28 | 21 |
| 2022 | 13 | 12 |
| 2023 | 13 | 17 |
| 2024 | 14 | 22 |
| 2025 | 13 | 12 |
| 2026 | 9 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Copper-tin-nickel brazing material prepared by alloys recycled from E-waste, preparation method therefor and system thereof15 Sep 2026US 12,735,765 B2Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
- High-performance copper alloy tube and preparation method thereof15 Sep 2026US 12,735,771 B2Zhejiang Hailiang Co., Ltd.
- Metal-ceramic substrate, method for the production thereof, and module28 Jul 2026US 12,692,202 B2Heraeus Electronics GmbH & Co. KG
- Silver-tin coating for electrical connectors, and electrical connectors with siliver-tin coatings28 Jul 2026US 12,695,229 B2Wieland Rolled Products North America, LLC
- Copper alloy, semifinished product and electrical connecting element comprising a copper alloy23 Jun 2026US 12,662,720 B2Wieland-Werke AG
- Sliding member17 Sep 2026US 2026/0276038 A1Daido Metal Company Ltd.
- Methods for manufacturing additive manufacturing components27 Aug 2026US 2026/0249350 A1Valls Besitz GmbH
- Sliding member and method for producing sliding member30 Jul 2026US 2026/0218749 A1Senju Metal Industry Co., Ltd.
- Sliding Coating for Composite Components and Method for Its Manufacture18 Jun 2026US 2026/0167887 A1Robert Bosch GmbH
- Apparatus and method for production of high purity copper-based alloys21 May 2026US 2026/0139346 A1Doggone Investment Co. LLC
Most cited
By later US patents
- Low thermal expansion composite comprising bodies of negative CTE material disposed within a positive CTE matrix35US 6,326,685 B1Agere Systems Guardian Corp. · 2001
- Copper based sintered contact material and double-layered sintered contact member30US 6,844,085 B2Komatsu Ltd. · 2005
- Copper alloy for electronic instruments and method of manufacturing the same25US 4,732,731 AFurukawa Electric Co., Ltd. · 1988
- Copper alloy and method of manufacturing the same24US 4,822,560 AFurukawa Electric Co., Ltd. · 1989
- High-strength, high-conductivity copper alloy22US 4,666,667 ANippon Mining Co., Ltd. · 1987