Copper alloy and method of manufacturing the same
AssigneeFurukawa Electric Co., Ltd.
InventorsYoshimasa Oyama, Masato Asai, Toru Tanigawa, Shigeo Shinozaki, Shoji Shiga
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AssigneeFurukawa Electric Co., Ltd.
InventorsYoshimasa Oyama, Masato Asai, Toru Tanigawa, Shigeo Shinozaki, Shoji Shiga
Estimating the term…
A copper alloy is disclosed which comprises 0.01 to 1.0 wt. % of Cr, 0.01 to 8 wt. % of Sn, 0.001 to 5 wt. % of at least one of 0.001 to 5 wt. % of Zn, 0.001 to 0.5 wt. % of Mn and 0.001 to 0.2 wt. % of Mg and the remainder of Cu, the content of O.sub.2 therein being not more than 0.005 wt. %. A method of manufacturing therefor is described wherein, after the hot processing or the heat treatment at 800.degree. to 950.degree. C., the alloy is cooled by passage through a region of 800.degree. to 400.degree. C. within 20 minutes, then following cold processing, heating treatment is carried out for at least 1 minute at 400.degree. to 650.degree. C. The alloy with the composition aforementioned is used as an alloy material for electric or electronic instruments.
An alloy consisting essentially of 0.09 to 0.4 wt.% of Cr, 0.01 to 8 wt.% of Sn, 0.001 to 5 wt.% in total of at least one of 0.001 to 5 wt.% of Zn, 0.001 to 0.5 wt.% of Mn and 0.001 to 0.2 wt.% of Mg and the balance being Cu, and wherein the content of O.sub.2 in said alloy is not more than 0.005 wt.%.
Dependencies are inferred from the claim text.