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AssigneeFurukawa Electric Co., Ltd.
InventorsMakoto Asai, Shoji Shiga, Toru Tanigawa, Yoshimasa Oyama, Shigeo Shinozaki
Estimating the term…
A copper alloy is disclosed, which contains 0.1 to 3.0 wt % of Ni, 0.1 to 1.0 wt % of Ti, the ratio of Ni to Ti being 4.ltoreq.Ni/Ti thereby, 0.1 to 6.0 wt % of Sn, and 0.005 to 3.0 wt % in total of one or more elements selected from the group consisting of Zn, Mn, Mg, Ca, RE, B, Sb, Te, Si, Co, Fe, Zr, Ag, Mm and Al, and consists of the remainder of Cu and the inevitable impurities. The method for the manufacture of the alloy is characterized in that, after copper alloy ingot was maintained and homogenized for 0.5 to 15 hours at 750.degree. to 960.degree. C. prior to rolling, the hot rolling is carried out starting from a temperature of 700.degree. to 880.degree. C. and the cooling is made immediately after the end of rolling.
A copper alloy for electronic instruments which consists essentially of 0.1 to 3.0 wt.% of Ni, 0.1 to 1.0 wt.% of Ti, wherein the ratio of Ni/Ti is greater than or equal to 4, 0.1 to 6.0 wt.% of Sn, and 0.005 to 3.0 wt.% in total of one or more elements selected from the group consisting of Zn, Mn, Mg, the rare earth elements, Ca, B, Sb, Te, Si, Co, Fe, Zr, Ag, MM (misch metal) and Al with the remainder being Cu and inevitable impurities, and wherein said alloy contains O.sub.2 in an amount of not more than 20 ppm, and wherein said alloy has a particle diameter of precipitates of not more than 5 .mu.m.
Dependencies are inferred from the claim text.