C22C 5/08
With copper as the next major constituent
Official title: with copper as the next major constituent
C22C5/08 (With copper as the next major constituent) appears on 169 US grants and 215 published applications in this corpus.
Search patents in C22C- Granted patents
- 169
- Published applications
- 215
- Assignees
- 141
- Inventors
- 405
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 3 |
| 2002 | 3 | 8 |
| 2003 | 4 | 4 |
| 2004 | 5 | 10 |
| 2005 | 5 | 7 |
| 2006 | 3 | 18 |
| 2007 | 6 | 10 |
| 2008 | 7 | 10 |
| 2009 | 4 | 9 |
| 2010 | 5 | 7 |
| 2011 | 7 | 7 |
| 2012 | 5 | 7 |
| 2013 | 1 | 7 |
| 2014 | 7 | 16 |
| 2015 | 12 | 14 |
| 2016 | 5 | 13 |
| 2017 | 15 | 10 |
| 2018 | 7 | 8 |
| 2019 | 10 | 4 |
| 2020 | 8 | 10 |
| 2021 | 3 | 10 |
| 2022 | 7 | 7 |
| 2023 | 4 | 2 |
| 2024 | 6 | 7 |
| 2025 | 4 | 6 |
| 2026 | 4 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonded substrate14 Jul 2026US 12,679,778 B2NGK Insulators, Ltd.
- Tool and manufacturing method of it21 Apr 2026US 12,605,782 B2Seco Tools AB
- Cutting tool7 Apr 2026US 12,594,599 B2AB Sandvik Coromant
- Composite member7 Apr 2026US 12,595,980 B2A. L. M. T. Corp.
- Diamond composite material and heat radiating member23 Dec 2025US 12,503,633 B2A. L. M. T. Corp.
- Silver-copper alloy welding ring used in heat dissipation devices2 Apr 2026US 2026/0092745 A1Purple Cloud Development Pte. Ltd.
- Cutting tool insert4 Dec 2025US 2025/0367734 A1AB Sandvik Coromant
- Process for Joining Silver-Graphite to Copper Carriers3 Jul 2025US 2025/0214164 A1ABB Schweiz AG
- Sterling silver alloy and articles made from same3 Jul 2025US 2025/0215529 A1Stuller, Inc.
- Copper-ceramic bonded substrate and method for manufacturing the same5 Jun 2025US 2025/0185158 A1Dowa Metaltech Co., Ltd.
Most cited
By later US patents
- Superabrasive elements, methods of manufacturing, and drill bits including same194US 8,236,074 B1US Synthetic Corporation · 2012
- Superabrasive elements, methods of manufacturing, and drill bits including same42US 8,323,367 B1US Synthetic Corporation · 2012
- Reflection layer or semi-transparent reflection layer for use in optical information recording media, optical information recording media and sputtering target for use in the optical information recording media35US 6,689,444 B2Kabushiki Kaisha Kobe Seiko Sho · 2004
- Copper alloy compositions31US 5,242,511 AAsahi Kasei Kogyo Kabushiki Kaisha · 1993
- Silver alloys of exceptional and reversible hardness19US 4,810,308 ALeach & Garner Company · 1989