Silver-copper alloy welding ring used in heat dissipation devices

Abstract

A heat dissipation device includes a plate body configured to be thermally coupled to a heat-generating element, a plate cover mounted to the plate body, the plate body and the plate cover together defining a vapor chamber, at least one internal wick structure disposed within the vapor chamber, a plurality of support columns disposed within the vapor chamber, and a plurality of heat pipes, each heat pipe extending through a corresponding through hole formed in the plate cover. The heat pipe is bonded to the plate cover by soldering a welding ring at an interface between the heat pipe and the corresponding through hole, the welding ring comprising a silver-copper alloy containing about 66% to about 76% silver and about 24% to about 34% copper.

Dependencies are inferred from the claim text.