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US 2025/0185158 A1Published application
Copper-ceramic bonded substrate and method for manufacturing the same
AssigneeDowa Metaltech Co., Ltd.
InventorsSeiya YUKI, Yuki TERAMOTO
Life of this patent
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Abstract
There is provided a copper-ceramic bonded substrate, including: a ceramic substrate; and a copper sheet bonded to at least one surface of the ceramic substrate, wherein the copper sheet has a Vickers hardness of 42.5 HV or less, and the copper sheet has a magnesium content of 1 ppm or less, a nickel content of 2.5 ppm or less, a tin content of 0.05 ppm or less, a selenium content of 0.3 ppm or less, a tellurium content of 0.07 ppm or less, and a bismuth content of 0.2 ppm or less.
Claims15
A copper-ceramic bonded substrate, comprising:
- a ceramic substrate;
- and
- a copper sheet bonded to at least one surface of the ceramic substrate,
- wherein the copper sheet has a Vickers hardness of 42.5 HV or less, and the copper sheet has a magnesium content of 1 ppm or less, a nickel content of 2.5 ppm or less, a tin content of 0.05 ppm or less, a selenium content of 0.3 ppm or less, a tellurium content of 0.07 ppm or less, and a bismuth content of 0.2 ppm or less.
1 more element
A method for manufacturing a copper-ceramic bonded substrate, comprising:
- placing a copper sheet on at least one surface of a ceramic substrate and heated to bond them together,
- wherein the copper sheet has a magnesium content of 1 ppm or less, a nickel content of 2.5 ppm or less, a tin content of 0.05 ppm or less, a selenium content of 0.3 ppm or less, a tellurium content of 0.07 ppm or less, and a bismuth content of 0.2 ppm or less, and
- in the bonding, the copper sheet is heated so that Vickers hardness of the copper sheet after bonding is 42.5 HV or less.
Dependencies are inferred from the claim text.