Copper alloy compositions
AssigneeAsahi Kasei Kogyo Kabushiki Kaisha
InventorsAkinori Yokoyama, Tsutomu Katsumata, Hitoshi Nakajima
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Abstract
A copper alloy composition comprising 100 parts by weight of powder of copper alloy represented by the general formula Ag.sub.x Cu.sub.y (wherein x and y are atomic ratio values; 0.001.ltoreq..times..ltoreq.0.999, 0.001.ltoreq.y.ltoreq.0.999, x+y=1), 5 to 200 parts by weight of one or more organic binders and 0.01 to 100 parts by weight of an additive capable of removing copper oxide; and a paste for screen printing, electromagnetic shielding, an electrically conductive additive, a paste for electrode and a paste for through hole, which are obtained by using said composition.
Claims16
An electrically conductive composition comprising 100 parts by weight of powder of a copper and silver alloy represented by the general formula Ag.sub.x Cu.sub.y (wherein x and y are atomic ratio values;
- 0.001.ltoreq.x.ltoreq.0.999, 0.001.ltoreq.y.ltoreq.0.999, x+y=1), from 5 to 200 parts by weight of one or more organic binders, and from 0.01 to 100 parts by weight of an additive capable of removing copper oxide.
A copper alloy powder comprising particles of an alloy of copper and silver in a ratio represented by the formula:
- Ag.sub.x Cu.sub.y (wherein x and y are atomic ratio values;
- 0.001.ltoreq.x.ltoreq.0.999, 0.001.ltoreq.y.ltoreq.0.999, x+y=1), the particles having an average particle size of from 0.1 to 100 .mu.m and having a surface silver concentration which is at least 2.1 times the average particle silver concentration, the particle silver concentration decreasing with distance from the particle surface.
Dependencies are inferred from the claim text.