C22C 30/04
Containing tin or lead
Official title: containing tin or lead
C22C30/04 (Containing tin or lead) appears on 130 US grants and 186 published applications in this corpus.
Search patents in C22C- Granted patents
- 130
- Published applications
- 186
- Assignees
- 125
- Inventors
- 471
- Latest grant
- 17 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 4 |
| 2004 | 1 | 4 |
| 2005 | 3 | 3 |
| 2006 | 3 | 3 |
| 2007 | 0 | 4 |
| 2008 | 0 | 6 |
| 2009 | 2 | 3 |
| 2010 | 4 | 3 |
| 2011 | 3 | 7 |
| 2012 | 5 | 7 |
| 2013 | 2 | 6 |
| 2014 | 6 | 11 |
| 2015 | 2 | 19 |
| 2016 | 4 | 20 |
| 2017 | 13 | 13 |
| 2018 | 1 | 8 |
| 2019 | 14 | 13 |
| 2020 | 14 | 6 |
| 2021 | 6 | 6 |
| 2022 | 5 | 13 |
| 2023 | 9 | 8 |
| 2024 | 9 | 7 |
| 2025 | 5 | 8 |
| 2026 | 3 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composite tube and welded joint17 Mar 2026US 12,577,646 B2Nippon Steel Corporation
- Solder alloy, joint portion, joining material, solder paste, joint structure, and electronic control device10 Mar 2026US 12,569,940 B2Tamura Corporation
- Stable undercooled metallic particles for filling a void24 Feb 2026US 12,559,824 B2Iowa State University Research Foundation, Inc.
- Water treatment apparatus28 Oct 2025US 12,454,474 B1Fdi Technologies Ltd
- System for smelting tin-containing materials and method for smelting same3 Jun 2025US 12,319,980 B2
- Alloy thermal fuse19 Mar 2026US 2026/0078469 A1Xiamen PVTECH Co., Ltd.
- Austenitic alloy material19 Mar 2026US 2026/0078473 A1Nippon Steel Corporation
- Multilayer composite thermally-conductive sheet and preparation method therefor and use thereof19 Feb 2026US 2026/0048569 A1Shenzhen Hfc Co., Ltd.
- Metal and electronic device5 Feb 2026US 2026/0035771 A1Senju Metal Industry Co., Ltd.
- Alloy material3 Jul 2025US 2025/0215536 A1Nippon Steel Corporation
Most cited
By later US patents
- Degradable compositions, apparatus comprising same, and method of use106US 8,211,247 B2Schlumberger Technology Corporation · 2012
- Degradable compositions, apparatus comprising same, and methods of use45US 8,663,401 B2Schlumberger Technology Corporation · 2014
- Degradable whipstock apparatus and method of use44US 8,220,554 B2Schlumberger Technology Corporation · 2012
- High entropy alloy having composite microstructure32US 10,570,491 B2The Industry & Academic Cooperation in Chungnam National University (IAC) · 2020
- Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same32US 7,554,201 B2Samsung Electronics Co., Ltd. · 2009