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US 2026/0035771 A1Published application
Metal and electronic device
AssigneeSenju Metal Industry Co., Ltd.
InventorsShuta AKATSUKA, Yutaka HASHIMOTO, Kengo OTA, Sakie OKADA
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Abstract
A metal according to the present invention comprises Ga and Bi, wherein the metal includes a liquid metal or a liquid metal and a solid metal at 35° C. The metal according to the present invention may comprise Bi in an amount of 0.01 mass % or more and 30 mass % or less. The metal according to the present invention may further comprise any one or more of In, Sn, Zn, and Ag.
Claims9
A metal comprising Ga and Bi,
- wherein the metal includes a liquid metal or a liquid metal and a solid metal at 35° C.
Dependencies are inferred from the claim text.