C09J 2471/006
In the substrate
Official title: in the substrate
C09J2471/006 (In the substrate) appears on 54 US grants and 77 published applications in this corpus.
Search patents in C09J- Granted patents
- 54
- Published applications
- 77
- Assignees
- 51
- Inventors
- 185
- Latest grant
- 12 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 1 |
| 2003 | 2 | 2 |
| 2004 | 1 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 0 | 1 |
| 2009 | 1 | 1 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 3 |
| 2013 | 1 | 3 |
| 2014 | 0 | 4 |
| 2015 | 1 | 5 |
| 2016 | 4 | 5 |
| 2017 | 3 | 6 |
| 2018 | 5 | 7 |
| 2019 | 6 | 2 |
| 2020 | 4 | 4 |
| 2021 | 2 | 5 |
| 2022 | 7 | 8 |
| 2023 | 6 | 4 |
| 2024 | 2 | 7 |
| 2025 | 3 | 4 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multilayer sheet and production method thereof12 May 2026US 12,624,254 B2Toagosei Co., Ltd.
- Direct application of thermosetting composite surfacing films to UV-treated thermoplastic surfaces and related composite structures31 Mar 2026US 12,589,555 B2Henkel AG & Co. KGaA
- Flexible hardgoods with enhanced peel removability18 Nov 2025US 12,471,723 B23M Innovative Properties Company
- Debonding tape and method of processing semiconductor wafer using the same29 Jul 2025US 12,374,575 B2Samsung Electronics Co., Ltd.
- Composite structures including a bonding layer and methods of making the composite structure17 Jun 2025US 12,329,237 B2NIKE, Inc.
- Compositions of chitin and hydrophilic and/or lipophilic wax, compositions of chitin and cellulosic material, and related methods for producing same13 Aug 2026US 2026/0234450 A1Neptune Nanotechnologies Inc.
- Adhesive sheet for provisional fixation of electronic component20 Nov 2025US 2025/0354034 A1Nitto Denko Corporation
- Sustainable water activated adhesive tape17 Jul 2025US 2025/0230342 A1Intertape Polymer Corp.
- Sustainable water activated adhesive tape12 Jun 2025US 2025/0188320 A1Intertape Polymer Corp.
- Adhesive film and method for producing adhesive film5 Jun 2025US 2025/0179336 A1Fujimori Kogyo Co., Ltd.
Most cited
By later US patents
- Paint replacement appliques39US 6,475,616 B13M Innovative Properties Company · 2002
- Easy to apply air and water barrier articles12US 10,704,254 B23M Innovative Properties Company · 2020
- Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same8US 6,733,880 B2Hitachi Chemical Company, Ltd. · 2004
- Primer for silicone compositions7US 6,475,329 B1Tyco Electronics Corporation · 2002
- Bonding method and bonding structure of thermoplastic resin material6US 6,605,357 B1Denso Corporation · 2003