C09J 2461/006
In the substrate
Official title: in the substrate
C09J2461/006 (In the substrate) appears on 13 US grants and 15 published applications in this corpus.
Search patents in C09J- Granted patents
- 13
- Published applications
- 15
- Assignees
- 11
- Inventors
- 48
- Latest grant
- 9 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 2 |
| 2005 | 0 | 1 |
| 2006 | 2 | 2 |
| 2007 | 0 | 0 |
| 2008 | 2 | 1 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 1 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 2 |
| 2020 | 0 | 1 |
| 2021 | 1 | 1 |
| 2022 | 1 | 0 |
| 2023 | 0 | 2 |
| 2024 | 1 | 0 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Process for the preparation of a bonded structure, a bonded structure and use of said bonded structure for preparing an automotive part9 Sep 2025US 12,409,613 B2Sabic Global Technologies B.V.
- Laminated rubber hose and method for manufacturing the same30 Jan 2024US 11,885,440 B2Kurashiki Kako Co., Ltd.
- Malonate and cyanoacrylate adhesives for joining dissimilar materials6 Sep 2022US 11,434,392 B2Zephyros, Inc.
- Multilayer adhesive article15 Jun 2021US 11,034,866 B23M Innovative Properties Company
- Flame retardant adhesive sheet6 Oct 2015US 9,150,760 B2Lintec Corporation
- Laminate and method for manufacturing laminate11 Sep 2025US 2025/0282983 A1Mitsui Chemicals, Inc.
- Adhesive composition2 Feb 2023US 2023/0035382 A1Shin-Etsu Polymer Co., Ltd.
- Process for the preparation of a bonded structure, a bonded structure and use of said bonded structure for preparing an automotive part26 Jan 2023US 2023/0024134 A1Sabic Global Technologies B.V.
- Thermal indicator, thermal indicating composition and thermal indicating structure1 Apr 2021US 2021/0095129 A13M Innovative Properties Company
- Laminated rubber hose and method for manufacturing the same19 Nov 2020US 2020/0362994 A1Kurashiki Kako Co., Ltd.
Most cited
By later US patents
- Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device13US 6,700,185 B1Hitachi Chemical Company, Ltd. · 2004
- Tie layer compositions for fiber reinforced thermoplastic—thermoset structural element9US 8,211,268 B1Milliken & Company · 2012
- Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device5US 7,057,266 B2Hitachi Chemical Company, Ltd. · 2006
- Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device5US 7,479,412 B2Hitachi Chemical Company, Ltd. · 2009
- Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device4US 7,378,722 B2Hitachi Chemical Company, Ltd. · 2008