C09J 2301/304
The adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°c
Official title: the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
C09J2301/304 (The adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°c) appears on 510 US grants and 861 published applications in this corpus.
Search patents in C09J- Granted patents
- 510
- Published applications
- 861
- Assignees
- 402
- Inventors
- 2,044
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 5 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 5 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 3 |
| 2002 | 5 | 7 |
| 2003 | 7 | 6 |
| 2004 | 6 | 7 |
| 2005 | 4 | 9 |
| 2006 | 3 | 12 |
| 2007 | 2 | 11 |
| 2008 | 2 | 10 |
| 2009 | 4 | 10 |
| 2010 | 7 | 12 |
| 2011 | 4 | 15 |
| 2012 | 8 | 28 |
| 2013 | 2 | 19 |
| 2014 | 12 | 21 |
| 2015 | 17 | 50 |
| 2016 | 17 | 40 |
| 2017 | 16 | 48 |
| 2018 | 30 | 44 |
| 2019 | 27 | 42 |
| 2020 | 37 | 33 |
| 2021 | 31 | 60 |
| 2022 | 20 | 100 |
| 2023 | 31 | 65 |
| 2024 | 62 | 78 |
| 2025 | 54 | 83 |
| 2026 | 32 | 48 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Method of manufacturing laminate and kit of adhesive compositions1 Sep 2026US 12,723,176 B2Nissan Chemical Corporation
- Water-based hot melt adhesive and nonwoven coated with the water-based hot melt adhesive1 Sep 2026US 12,723,177 B2BenQ Materials Corporation
- Hot-melt adhesive8 Oct 2026US 2026/0308421 A1National Institute of Advanced Industrial Science and Technology
- Heat-sealing paper for packaging a solid product1 Oct 2026US 2026/0297389 A1Riccobono Patents Limited
- Adhesive agent composition, adhesive agent film for circuit connection, circuit connection structure, and method for manufacturing same24 Sep 2026US 2026/0293741 A1
- Thermoplastic multilayer adhesive film10 Sep 2026US 2026/0265583 A1Aicello Corporation
- Adhesive composition, film-like adhesive and semiconductor package using same, and method for manufacturing semiconductor package10 Sep 2026US 2026/0265584 A1Furkuawa Electric Co., Ltd.
Most cited
By later US patents
- Magnetized hot melt adhesive articles135US 5,985,435 AL&L Products, Inc. · 1999
- Polyarylether ketone imide sulfone adhesives118US 9,976,063 B2The Boeing Company · 2018
- Pressure-sensitive structural adhesive65US 5,593,759 AAvery Dennison Corporation · 1997
- Prelaminate pressure-sensitive adhesive constructions64US 6,540,865 B1Avery Dennison Corporation · 2003
- Paintable seal system64US 6,620,501 B1L&L Products, Inc. · 2003