Adhesive composition, film-like adhesive and semiconductor package using same, and method for manufacturing semiconductor package

An adhesive composition containing at least an epoxy resin (A), an epoxy resin curing agent (B), and a polymer component (C), wherein:

• under the following conditions after curing, the adhesive composition has a storage elastic modulus of 2,000 MPa or less and a loss tangent of 0.03 or more, and when the compositions are bonded to one another after curing, bonding strength under the following conditions is 5 MPa or more, the conditions being:
• the storage elastic modulus and loss tangent after curing are measured under conditions of a measuring temperature range of 20 to 300° C., a heating rate of 5° C./min, and a frequency of 1 Hz, after thermally curing the adhesive composition at 180° C. for one hour, thereby obtaining a film-like adhesive piece of 5 mm×17 mm×200 μm, and at this time, measured values at a bonding temperature below are sampled;
• the bonding temperature is any temperature of 25° C. or more and 300° C. or less;
• and
• the bonding strength is the strength required to peel and separate at room temperature two chips attached with film-like adhesives, each film-like adhesive being made to have a thickness of 1.0 μm by heating the adhesive composition at 180° C. for one hour followed by thermal curing and the two chips being bonded together at the bonding temperature by butting against each other the film-like adhesives of both.