C09J 2301/208
The adhesive layer being constituted by at least two or more adjacent
Official title: the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
C09J2301/208 (The adhesive layer being constituted by at least two or more adjacent) appears on 465 US grants and 753 published applications in this corpus.
Search patents in C09J- Granted patents
- 465
- Published applications
- 753
- Assignees
- 268
- Inventors
- 1,623
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 6 | 0 |
| 2001 | 6 | 1 |
| 2002 | 7 | 6 |
| 2003 | 14 | 10 |
| 2004 | 2 | 17 |
| 2005 | 2 | 10 |
| 2006 | 6 | 16 |
| 2007 | 8 | 18 |
| 2008 | 1 | 17 |
| 2009 | 6 | 14 |
| 2010 | 8 | 33 |
| 2011 | 9 | 26 |
| 2012 | 14 | 31 |
| 2013 | 13 | 40 |
| 2014 | 9 | 31 |
| 2015 | 19 | 29 |
| 2016 | 15 | 36 |
| 2017 | 26 | 49 |
| 2018 | 27 | 41 |
| 2019 | 40 | 36 |
| 2020 | 34 | 41 |
| 2021 | 20 | 70 |
| 2022 | 35 | 40 |
| 2023 | 26 | 35 |
| 2024 | 27 | 42 |
| 2025 | 30 | 46 |
| 2026 | 24 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Adhesive sheet, display device using the same, composition for forming adhesive layer used for production of adhesive film8 Sep 2026US 12,729,323 B2Toppan Inc.
- Adhesive film for semiconductor and semiconductor package using the same8 Sep 2026US 12,729,324 B2LG Chem.Ltd.
- Adhesive label8 Sep 2026US 12,729,325 B2Upm Raflatac Oy
- Method of manufacturing laminate and kit of adhesive compositions1 Sep 2026US 12,723,176 B2Nissan Chemical Corporation
- Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor18 Aug 2026US 12,709,083 B2Resonac Corporation
- Adhesive sheet8 Oct 2026US 2026/0308423 A1Samsung SDI.Co., Ltd.
- Patterned adhesives for use with transfer printing1 Oct 2026US 2026/0297392 A1Avery Dennison Corporation
- Laminated film and method for producing laminated film1 Oct 2026US 2026/0297393 A1Resonac Corporation
- Film adhesive, dicing/die attach film, semiconductor device, and production method for same24 Sep 2026US 2026/0293603 A1Resonac Corporation
- Thermoplastic multilayer adhesive film10 Sep 2026US 2026/0265583 A1Aicello Corporation
Most cited
By later US patents
- Pressure-sensitive structural adhesive65US 5,593,759 AAvery Dennison Corporation · 1997
- Prelaminate pressure-sensitive adhesive constructions64US 6,540,865 B1Avery Dennison Corporation · 2003
- Porous adhesive tape63US 4,112,177 AMinnesota Mining and Manufacturing Company · 1978
- Unified pressure-sensitive adhesive tape63US 4,818,610 AMinnesota Mining and Manufacturing Company · 1989
- Process of making a unified pressure-sensitive adhesive tape58US 4,894,259 AMinnesota Mining and Manufacturing Company · 1990