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US 12,729,324 B2Granted
Adhesive film for semiconductor and semiconductor package using the same
AssigneeLG Chem, Ltd.
InventorsKi Beom Kim, Min Su Jeong, Jung Hak Kim, Eun Byurl Cho
Life of this patent
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Abstract
A film for bonding semiconductors, which easily controls the fillet while exhibiting excellent adhesion force, and can prevent a problem in which solder is melted and fused to a chip; and a semiconductor package using the same.
Claims14
A film for bonding semiconductors, comprising:
- a first adhesive layer containing a first adhesive composition comprising a first thermosetting resin, a first thermoplastic resin, and a first thermal curing agent;
- and
- a second adhesive layer on the first adhesive layer and comprises a second adhesive composition comprising a second thermosetting resin, a second thermoplastic resin, a second thermal curing agent, a photopolymerizable monomer containing one or more photocurable functional groups, and a photoinitiator,
- wherein, after light is irradiated to the film for bonding semiconductors,
- the first adhesive layer has a melt viscosity of 100 to 2,000 Pa·s,
- the second adhesive layer has a melt viscosity of 200 to 5,000 Pa·s,
- and the first adhesive layer and the second adhesive layer have different melt viscosities.
4 more elements
Dependencies are inferred from the claim text.