C09J 171/12
Polyphenylene oxides
C09J171/12 (Polyphenylene oxides) appears on 35 US grants and 54 published applications in this corpus.
Search patents in C09J- Granted patents
- 35
- Published applications
- 54
- Assignees
- 44
- Inventors
- 140
- Latest grant
- 22 Oct 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 2 |
| 2004 | 1 | 0 |
| 2005 | 1 | 1 |
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 2 |
| 2014 | 2 | 2 |
| 2015 | 0 | 4 |
| 2016 | 3 | 2 |
| 2017 | 3 | 5 |
| 2018 | 1 | 6 |
| 2019 | 3 | 4 |
| 2020 | 2 | 2 |
| 2021 | 3 | 6 |
| 2022 | 1 | 3 |
| 2023 | 3 | 3 |
| 2024 | 3 | 2 |
| 2025 | 0 | 3 |
| 2026 | 0 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composition comprising maleimide pre-polymerized resin22 Oct 2024US 12,122,912 B2Elite Material Co., Ltd.
- Circuit material and circuit board containing the same12 Mar 2024US 11,930,595 B2Shengyi Technology Co., Ltd.
- Implant assembly and method of making27 Feb 2024US 11,911,534 B2Zimmer, Inc.
- Adhesive composition for semiconductor circuit connection and adhesive film including the same5 Dec 2023US 11,834,415 B2LG Chem.Ltd.
- Resin composition and use thereof18 Jul 2023US 11,702,507 B2Shikoku Chemicals Corporation
- Method for manufacturing joined body27 Aug 2026US 2026/0250555 A1Resonac Corporation
- Flame retardant and use thereof13 Aug 2026US 2026/0234171 A1Shikoku Chemicals Corporation
- Joining method30 Jul 2026US 2026/0223331 A1Resonac Corporation
- Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminated plate, and wiring board1 Jan 2026US 2026/0002026 A1Panasonic Intellectual Property Management Co., Ltd.
- Curable adhesive and articles for bonding pavement and concrete14 Aug 2025US 2025/0257248 A13M Innovative Properties Company
Most cited
By later US patents
- Adhesive composition containing a pre-blended polyphenylene ether resin28US 4,104,323 AShell Oil Company · 1978
- Additive composition and method for increasing the upper service temperature of adhesives18US 5,789,474 AArizona Chemical Company · 1998
- Adhesive composition containing a block copolymer composition and polyphenylene oxide resin and products thereof14US 6,277,488 B13M Innovative Properties Company · 2001
- Poly(arylene ether) adhesive compositions10US 6,906,120 B1General Electric Company · 2005
- Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith10US 9,265,160 B2Rogers Corporation · 2016