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US 11,702,507 B2Granted
Resin composition and use thereof
AssigneeShikoku Chemicals Corporation
InventorsAkihito Otsuka, Takashi Kashiwabara, Kazunori Aoki, Takeshi Kumano
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Abstract
This invention provides a material having a low dissipation factor that is suitable for use as an insulating material for a printed wiring board and the like; a resin composition used for the production of the material; and an application using the material. The present invention relates to a resin composition comprising a mono(C6-C20 alkyl)diallyl isocyanurate and a polyphenylene ether resin; a cured product of the resin composition; and use of the cured product.
Claims18
A resin composition comprising a compound represented by formula (I) and a polyphenylene ether resin:
- wherein RB represents C6-C20 alkyl.
Dependencies are inferred from the claim text.