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US 11,834,415 B2Granted
Adhesive composition for semiconductor circuit connection and adhesive film including the same
AssigneeLG Chem, Ltd.
InventorsJu Hyeon Kim, Junghak Kim, Seunghee Nam, Kwang Joo Lee
Life of this patent
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Abstract
The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.
Claims14
An adhesive resin composition for bonding semiconductors, comprising:
- a thermoplastic resin;
- a thermosetting resin;
- a curing agent;
- and a compound represented by Chemical Formula 1 or 2-(4,5-Dihydro-1H-imidazol-2-yl)phenol:
- wherein in the Chemical Formula 1,
- R1 is hydrogen, a C1 to C10 alkyl group, or a C6 to C20 aryl group,
- R2 is a carboxyl group, a carbonyl group, a formyl group, or an amine group,
- R3 is hydrogen, a halogen, a C1 to C10 alkyl group, or a C6 to C20 aryl group, and
- n is 1 to 4.
6 more elements
Dependencies are inferred from the claim text.