C09J 163/04
Epoxynovolacs
C09J163/04 (Epoxynovolacs) appears on 121 US grants and 162 published applications in this corpus.
Search patents in C09J- Granted patents
- 121
- Published applications
- 162
- Assignees
- 87
- Inventors
- 355
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 2 |
| 2010 | 0 | 2 |
| 2011 | 1 | 3 |
| 2012 | 0 | 4 |
| 2013 | 0 | 8 |
| 2014 | 6 | 4 |
| 2015 | 8 | 15 |
| 2016 | 6 | 13 |
| 2017 | 14 | 10 |
| 2018 | 9 | 13 |
| 2019 | 11 | 9 |
| 2020 | 9 | 22 |
| 2021 | 9 | 19 |
| 2022 | 8 | 12 |
| 2023 | 9 | 7 |
| 2024 | 14 | 7 |
| 2025 | 8 | 5 |
| 2026 | 4 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding method16 Jun 2026US 12,655,333 B2Nitto Denko Corporation
- Composition2 Jun 2026US 12,644,031 B2Kansai Helios Austria GmbH
- Adhesive film that can be wound and stamped31 Mar 2026US 12,590,230 B2Lohmann GmbH & Co. KG
- Adhesive compositions for anchoring fasteners24 Mar 2026US 12,584,049 B2H. B. Fuller Company
- Adhesive sheet, semiconductor module, and method for producing adhesive sheet30 Dec 2025US 12,509,616 B2Nitto Shinko Corporation
- Tertiary amines for improving the creep behavior of chemical anchors8 Oct 2026US 2026/0308425 A1Hilti Aktiengesellschaft
- Windblade repair adhesive and a process for use thereof8 Oct 2026US 2026/0308429 A1Illinois Tool Works Inc.
- Injectable rapid-cure two-part composition1 Oct 2026US 2026/0297399 A1Zephyros, Inc.
- Two-Component Rapid Cure Adhesive7 May 2026US 2026/0125585 A1
- Adhesives Adapted For Spray Applications23 Apr 2026US 2026/0109888 A1
Most cited
By later US patents
- Electrical devices employing a conductive epoxy resin formulation as a bonding medium31US 4,210,704 ABell Telephone Laboratories, Incorporated · 1980
- Epoxy adhesive for structurally bonding molded SMC20US 4,383,060 AGeneral Motors Corporation · 1983
- Surfacing film for composite structures and method of making the same13US 9,676,961 B2Cytec Technology Corp. · 2017
- Adhesive for rubber bonding5US 10,005,935 B2Lord Corporation · 2018
- Non-flammable adhesive compositions5US 4,323,659 ASony Corporation · 1982