Electrical devices employing a conductive epoxy resin formulation as a bonding medium
AssigneeBell Telephone Laboratories, Incorporated
InventorsEdwin A. Chandross, Louis H. Sharpe
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Abstract
A technique is described for the preparation of an electrically conductive adhesive system and electrical devices including such system. Briefly, the adhesive system comprises a novolac epoxy resin and a chemically blocked imidazole curing agent in combination with a viscosity reducer and conductive particles. The resulting adhesive system is found comparable to commercially available adhesive systems and is superior thereto with respect to thermal stability.
Claims4
Device comprising a first electrically conductive or semiconducting member and a second electrically conductive or semiconducting member, said first member being bonded to said second member by a bonding agent, said bonding agent consisting essentially of (a) a polyfunctional epoxide, (b) a reactive viscosity reducer which is a mono or difunctional aliphatic diglycidyl ether, (c) a curing agent, and (d) a conductive material, characterized in that said curing agent consists essentially of an imidazole compound having the general formula ##STR3## wherein R.sup.1 represents hydrogen, a phenyl group or an alkoxyphenyl group having from 1-6 carbon atoms in the alkoxy chain;
- R.sup.2 and R.sup.3 represent an alkyl group of 1-6 carbon atoms, a phenyl group or hydrogen;
- and Y represents a cyclic group of the formula (CH.sub.2).sub.4 or (CH.sub.2).sub.5, or O(CH.sub.2).sub.4 ;
- or two alkyl groups, (R.sup.4).sub.2, wherein R.sup.4 is an aklyl group having from 1-6 carbon atoms.
Dependencies are inferred from the claim text.