Non-flammable adhesive compositions
AssigneeSony Corporation
InventorsMasanao Watanabe, Keiichi Naito, Tooru Odajima, Yoshio Fujiwara
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Abstract
The non-flammable adhesive compositions contain 100 parts by weight of a brominated epoxy resin such as a bisphenol type brominated epoxy resin or a novolak type brominated epoxy resin; 40-80 parts by weight of an acrylic copolymer and 5-20 parts by weight of a brominated polyvinyl phenol, said acrylic copolymer being prepared by copolymerizing (a) 5-35% by weight of acrylonitrile, (b) 0.5-10% by weight of an ethylenically unsaturated compound having at least one functional group selected from carboxyl, hydroxyl and epoxy group, and (c) substantially the balance of an ester obtainable from an alcohol having from 1 to 6 carbon atoms and acrylic acid and/or methacrylic acid.
Claims11
A non-flamable adhesive composition comprising 100 parts by weight of a brominated epoxy resin, 40-80 parts by weight of an acrylic copolymer and 5-20 parts by weight of a brominated polyvinylphenol, said acrylic copolymer being prepared by copolymerizing (a) 5-35% by weight of acrylonitrile, (b) 0.5-10% by weight of an ethylenically unsaturated compound having at least one functional group selected from carboxyl group, hydroxyl group and epoxy group, and (c) substantially the balance of an ester obtainable from an alcohol having from 1 to 6 carbon atoms and acrylic acid and/or methacrylic acid.
Dependencies are inferred from the claim text.