C09D 179/085
Unsaturated polyimide precursors
Official title: {Unsaturated polyimide precursors}
C09D179/085 (Unsaturated polyimide precursors) appears on 45 US grants and 70 published applications in this corpus.
Search patents in C09D- Granted patents
- 45
- Published applications
- 70
- Assignees
- 54
- Inventors
- 218
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 2 | 3 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 1 | 1 |
| 2008 | 0 | 1 |
| 2009 | 1 | 2 |
| 2010 | 0 | 0 |
| 2011 | 2 | 0 |
| 2012 | 1 | 3 |
| 2013 | 1 | 4 |
| 2014 | 1 | 2 |
| 2015 | 5 | 3 |
| 2016 | 1 | 2 |
| 2017 | 0 | 7 |
| 2018 | 1 | 4 |
| 2019 | 4 | 4 |
| 2020 | 2 | 2 |
| 2021 | 4 | 9 |
| 2022 | 2 | 5 |
| 2023 | 1 | 4 |
| 2024 | 3 | 3 |
| 2025 | 4 | 7 |
| 2026 | 1 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Resin composition and article made therefrom30 Jun 2026US 12,668,717 B1Elite Material Co., Ltd.
- Method of insulating a motor2 Dec 2025US 12,486,426 B2Suzhou Jufeng Electrical Insulation System Co., Ltd.
- Photosensitive resin composition, method of manufacturing pattern cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component12 Aug 2025US 12,386,257 B2Hd Microsystems, Ltd.
- Polyimide precursor resin composition for forming flexible device substrate17 Jun 2025US 12,330,981 B2Ube Corporation
- Method for producing cured product of heat-curable maleimide resin composition1 Apr 2025US 12,264,270 B2Shin-Etsu Chemical Co., Ltd.
- Method for manufacturing semiconductor device, and curable resin composition1 Oct 2026US 2026/0305463 A1Resonac Corporation
- Compositions for forming polyimide coatings13 Aug 2026US 2026/0234438 A1Hd Microsystems, Ltd.
- Polyimide varnish with improved pulse endurance and polyimide coating material prepared thereof2 Apr 2026US 2026/0092194 A1PI Advanced Materials Co., Ltd.
- High temperature surfacing film for composite substrates19 Mar 2026US 2026/0078278 A1Cytec Industries Inc.
- Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component27 Nov 2025US 2025/0362601 A1Hd Microsystems, Ltd.
Most cited
By later US patents
- Plastic optical articles28US 5,514,466 AToray Industries, Inc. · 1996
- Mixtures containing polymides alkenyphenols and either epoxide group-free adducts or another polyimide25US 4,826,927 ACiba-Geigy Corporation · 1989
- Thermosettable resin compositions with improved storage stability and oxidative stability11US 5,955,566 ACytec Technology Corp. · 1999
- Curable adhesive compositions9US 6,818,680 B2Corning Incorporated · 2004
- Process for producing fire retardant and heat resistant copper-clad laminated board, and varnish therefor6US 4,400,438 AHitachi Chemical Company, Ltd. · 1983