Photosensitive resin composition, method of manufacturing pattern cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component

A photosensitive resin composition comprising:

• (A) a polyimide precursor having a polymerizable unsaturated bond;
• (B) a photopolymerization initiator comprising a compound represented by the following formula (11);
• (C) a thermal radical generator;
• (D) a solvent containing γ-butyrolactone:
• wherein in the formula (11), R11 is a substituted or unsubstituted benzoyl group, a substituted or unsubstituted fluorenyl group, or a group comprising a substituted or unsubstituted carbazolyl group;
• R12 is an alkyl group including 1 to 12 carbon atoms, a group comprising a cycloalkyl group including 4 to 10 carbon atoms, a group comprising a phenyl group, or a group comprising a tolyl group;
• R13 is a substituted or unsubstituted aromatic hydrocarbon group including 6 to 20 carbon atoms;
• tricyclodecanedimethanol diacrylate;
• and
• one or more polymerizable monomers selected from the group consisting of diethyleneglycol di(metha)acrylate, triethyleneglycol di(metha)acrylate, tetraethyleneglycol di(metha)acrylate, trimethylol propanedi(metha)acrylate, trimethylol propanetri(metha)acrylate, 1,4-butanediol di(metha)acrylate, 1,6-hexanediol di(metha)acrylate, pentaerythritol tri(metha)acrylate, pentaerythritol tetra(metha)acrylate, and ethoxylated pentaerythritol tetra(metha)acrylate.