Mixtures containing polymides alkenyphenols and either epoxide group-free adducts or another polyimide

Abstract

Storage-stable heat-curable mixtures are described which contain (A) a polyimide which contains in the molecule at least two radicals of formula I ##STR1## wherein D is a divalent radical with a C.dbd.C double bond, (B) an alkenylphenol, (C) an epoxide group-free adduct of an epoxy resin with excess alkenylphenol or (D) a polyimide which is soluble in organic solvents or a mixture of (C) and (D). These mixtures are employed for example as laminating resins or electro-resins, as adhesives or adhesive films for application at high temperatures, or for the preparation of coatings.

Dependencies are inferred from the claim text.