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US 5,955,566 AGranted
Thermosettable resin compositions with improved storage stability and oxidative stability
AssigneeCytec Technology Corp.
InventorsJean Lee, Jack Douglas Boyd, Albert Kuo
Life of this patent
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Abstract
Thermosetting polymers with high temperature capability for composite and adhesive applications are disclosed. Inhibitors for improving pot life, gel time and storage stability are disclosed. These polymers are ideally suited for adhesives and RTM, resin film infusion, and prepreg methods to make polymer matrix, fiber reinforced composite parts.
Claims13
A thermosettable resin composition comprising:
- A. a bismaleimide monomer;
- B. a liquid co-reactant having at least one olefinic group and at least one aromatic ring;
- and
- C. a free radical inhibitor;
- wherein the composition before curing has improved room temperature storage stability, as characterized by gel time measured in minutes at 149.degree. C. upon preparation, and at 47 days post-preparation;
- wherein the gel time at 47 days post-preparation is greater than the gel time measured upon preparation.
3 more elements
A thermosettable resin composition comprising:
- A. a bismaleimide monomer;
- B. a liquid co-reactant having at least one olefinic group and at least one aromatic ring;
- and
- C. a free radical inhibitor;
- wherein the composition before curing has improved room temperature storage stability, as characterized by gel time measured in minutes at 163.degree. C. upon preparation and at 35 days post-preparation;
- wherein the gel time at 35 days post-preparation is greater than, equal to, or no more than about 6 minutes less than the gel time measured upon preparation.
3 more elements
Dependencies are inferred from the claim text.