C08L 2203/206
Use in coating or encapsulating of electronic parts
Official title: use in coating or encapsulating of electronic parts
C08L2203/206 (Use in coating or encapsulating of electronic parts) appears on 361 US grants and 567 published applications in this corpus.
Search patents in C08L- Granted patents
- 361
- Published applications
- 567
- Assignees
- 268
- Inventors
- 1,435
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 2 |
| 2011 | 0 | 6 |
| 2012 | 1 | 5 |
| 2013 | 2 | 11 |
| 2014 | 3 | 13 |
| 2015 | 14 | 40 |
| 2016 | 16 | 43 |
| 2017 | 32 | 34 |
| 2018 | 27 | 48 |
| 2019 | 33 | 64 |
| 2020 | 47 | 80 |
| 2021 | 46 | 47 |
| 2022 | 30 | 43 |
| 2023 | 39 | 46 |
| 2024 | 30 | 34 |
| 2025 | 19 | 35 |
| 2026 | 20 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Heat-curable bismaleimide resin composition15 Sep 2026US 12,735,535 B2Shin-Etsu Chemical Co., Ltd.
- Bismaleimide compound, composition containing same, polybenzoxazole, and semiconductor device15 Sep 2026US 12,736,879 B2Nippon Kayaku Kabushiki Kaisha
- Steel cord coating rubber composition and pneumatic tire8 Sep 2026US 12,729,290 B2Toyo Tire Corporation
- Coated electric cable sealing composition, and method for sealing coated electric cable8 Sep 2026US 12,729,300 B2Toagosei Co., Ltd.
- Silicone gel composition, cured product thereof, and use therefor8 Sep 2026US 12,729,306 B2Dow Toray Co., Ltd.
- Resin Composition and Use Thereof8 Oct 2026US 2026/0308375 A1Tokuyama Corporation
- Resin composition and electronic component device24 Sep 2026US 2026/0286121 A1Resonac Corporation
- Thermoplastic Resin Composition and Molded Article Manufactured Therefrom17 Sep 2026US 2026/0275104 A1Lotte Chemical Corporation
- Thermosetting resin composition, cured product, and flexible printed board27 Aug 2026US 2026/0250500 A1Resonac Corporation
- Easily dismantlable thermosetting resin composition and dismantling method27 Aug 2026US 2026/0250508 A1Sumitomo Bakelite Co., Ltd.
Most cited
By later US patents
- Flexible insulation with improved discoloration and heat age resistance23US 4,382,112 AGeneral Electric Company · 1983
- Information carrying card comprising a cross-linked polymer composition, and method of making the same23US 9,122,968 B2X-Card Holdings, LLC · 2015
- Information carrying card comprising a cross-linked polymer composition, and method of making the same23US 9,183,486 B2X-Card Holdings, LLC · 2015
- Wholly aromatic liquid crystalline polyester resin17US 10,968,347 B2Jxtg Nippon Oil & Energy Corporation · 2021
- Resin composition and display unit14US 9,423,638 B2Dexerials Corporation · 2016