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US 2026/0286121 A1Published application
Resin composition and electronic component device
AssigneeResonac Corporation
InventorsYuta SUKEGAWA, Ayumi NAKAYAMA, Masashi YAMAURA
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Abstract
A resin composition contains an epoxy resin, an active ester compound as a curing agent, an inorganic filler containing silica, and a cyclic carbodiimide compound.
Claims10
A resin composition, comprising an epoxy resin, an active ester compound as a curing agent, an inorganic filler containing silica, and a cyclic carbodiimide compound.
Dependencies are inferred from the claim text.