C08K 2003/282
Binary compounds of nitrogen with aluminium
Official title: {Binary compounds of nitrogen with aluminium}
C08K2003/282 (Binary compounds of nitrogen with aluminium) appears on 139 US grants and 305 published applications in this corpus.
Search patents in C08K- Granted patents
- 139
- Published applications
- 305
- Assignees
- 146
- Inventors
- 717
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 4 |
| 2015 | 2 | 12 |
| 2016 | 4 | 8 |
| 2017 | 5 | 14 |
| 2018 | 8 | 14 |
| 2019 | 5 | 25 |
| 2020 | 21 | 29 |
| 2021 | 13 | 23 |
| 2022 | 10 | 28 |
| 2023 | 23 | 39 |
| 2024 | 11 | 45 |
| 2025 | 20 | 39 |
| 2026 | 16 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Resin Composition1 Oct 2026US 2026/0297295 A1Tokuyama Corporation
- Thermally conductive silicone composition and production method therefor1 Oct 2026US 2026/0297411 A1Shin-Etsu Chemical Co., Ltd.
- Molded body, downhole tool member, and downhole tool24 Sep 2026US 2026/0286043 A1Kureha Corporation
- Compositions containing thermally conductive fillers3 Sep 2026US 2026/0258279 A1PPG Industries Ohio, Inc.
Most cited
By later US patents
- Inks for 3D printing gradient refractive index (GRIN) optical components19US 9,447,299 B2Voxtel, Inc. · 2016
- Polymer thermal interface material having enhanced thermal conductivity15US 9,070,660 B2Intel Corporation · 2015
- Thermally reversible thermal interface materials with improved moisture resistance6US 9,085,719 B2International Business Machines Corporation · 2015
- Thermally conductive silicone composition and electrical/electronic apparatus4US 10,150,902 B2Dow Corning Toray Co., Ltd. · 2018
- Thermally conductive silicone composition and cured product thereof4US 10,647,830 B2Shin-Etsu Chemical Co., Ltd. · 2020