Thermal radical curable thermoconductive silicone composition, and method for producing same

A thermal radical curable thermoconductive silicone composition comprising:

• an addition reaction product of the following component (A) and component (B);
• (C) a thermoconductive filler having a thermal conductivity of 10 W/m·K or more in an amount of 20 to 95% by mass based on a total amount of the composition;
• (D) a platinum group metal catalyst;
• and (E) an organic peroxide in an amount of 1 to 10 parts by mass based on 100 parts by mass of the component (A), wherein
• the component (A) is an organopolysiloxane having a kinematic viscosity at 25° C. of 10 to 100,000 mm2/s and containing one or more aliphatic unsaturated groups per molecule,
• the component (B) is a polyorganohydrogensiloxane having one or more silicon atom-bonded hydrogen atoms in one molecule, and having at least one group of an acrylate group and a methacrylate group, and
• the number of the silicon atom-bonded hydrogen atoms in the component (B) divided by the number of the aliphatic unsaturated groups in the component (A) is 0.1 to 3.0.