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US 10,647,830 B2Granted
Thermally conductive silicone composition and cured product thereof
AssigneeShin-Etsu Chemical Co., Ltd.
InventorTakanori Ito
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AssigneeShin-Etsu Chemical Co., Ltd.
InventorTakanori Ito
Estimating the term…
A thermally conductive silicone composition having an organopolysiloxane as a base polymer and containing a thermally conductive filler, wherein the thermally conductive silicone composition that includes aluminum nitride having an average particle size of 10-100 μm and crushed alumina having an average particle size of 0.1-5 μm as a thermally conductive filler, contains 15-55 mass % of crushed alumina in the total amount of aluminum nitride and crushed alumina, and contains a total of 60-95 mass % of aluminum nitride and crushed alumina in the thermally conductive silicone composition has excellent moldability, high thermal conductivity and low thermal resistance, can give a cured product also having excellent water resistance, and has good adhesiveness during mounting when used as a heat-dissipating member.
A thermally conductive silicone composition comprising an organopolysiloxane as a base polymer and a thermally conductive filler, wherein the thermally conductive filler includes aluminum nitride having an average particle size of 10 to 100 μm and crushed alumina having an average particle size of 0.1 to 5 μm, the crushed alumina accounting for 15 to 55 wt % of the collective amount of aluminum nitride and crushed alumina, and the aluminum nitride and crushed alumina collectively accounting for 60 to 95 wt % of the thermally conductive silicone composition.
Dependencies are inferred from the claim text.