Loading patent…
AssigneeDow Corning Toray Co., Ltd.
InventorsTomoko Kato, Harumi Kodama, Masayuki Onishi
Estimating the term…
Provided are a thermally conductive silicone composition excelling in heat resistance and thermal conductivity, in which thickening in an uncured state is suppressed, and which has excellent handling ease; and an electrical/electronic apparatus in which the thermally conductive silicone composition is used as a member. The thermally conductive silicone composition comprises (A) 100 parts by mass of either i) (a1) an organopolysiloxane having, in each molecule thereof, at least one alkoxysilyl-containing group bonded to a silicon atom and expressed by the general formula: and as generally described herein, or ii) a mixture of component (a1) and (a2) an organopolysiloxane having in each molecule thereof, at least two alkenyl groups but not the alkoxysilyl-containing group. In the mixture, the content of component (a1) is 10 to less than 100 mass %. The thermally conductive silicone composition further comprises (B) 400 to 3,500 parts by mass of a thermally conductive filler.
A thermally conductive silicone composition comprising:
The thermally conductive silicone composition according to 1, wherein component (a1) has at least two of the alkoxysilyl-containing groups.
The thermally conductive silicone composition according to 1, wherein component (a1) comprises a straight chain organopolysiloxane having the alkoxysilyl-containing groups bonded to silicon atoms at both termini of the molecular chain.
The thermally conductive silicone composition according to 1, wherein component (B) comprises aluminum oxide powder.
The thermally conductive silicone composition according to 7, which is free of a curing catalyst.
The thermally conductive silicone composition according to 8, further comprising (C) a curing catalyst.
The thermally conductive silicone composition according to 1, wherein component (a1) has an average of at least 0.5 and not more than 20 alkenyl groups.
The thermally conductive silicone composition according to 1, further comprising (a3) an organopolysiloxane having, in each molecule thereof, at least two silicon atom bonded hydrogen atoms.
The thermally conductive silicone composition according to 1, further comprising (D) a silica-based filler, (E) a coupling agent, or a combination thereof.
A curable thermally conductive silicone composition comprising:
Dependencies are inferred from the claim text.