C08J 2461/34
Condensation polymers of aldehydes or ketones with monomers covered by at least
Official title: Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08J2461/04, C08J2461/18, and C08J2461/20
C08J2461/34 (Condensation polymers of aldehydes or ketones with monomers covered by at least) appears on 3 US grants and 5 published applications in this corpus.
Search patents in C08J- Granted patents
- 3
- Published applications
- 5
- Assignees
- 4
- Inventors
- 16
- Latest grant
- 28 Jun 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2017 | 0 | 2 |
| 2018 | 1 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 1 | 1 |
| 2022 | 1 | 1 |
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Recent patents
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- Resin composition for printed circuit board, prepreg, resin composite sheet and metal foil clad laminate27 Feb 2018US 9,907,166 B2Mitsubishi Gas Chemical Company, Inc.
- Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device8 Dec 2022US 2022/0389130 A1Mitsubishi Gas Chemical Company, Inc.
- Resin composition and article made therefrom14 Jan 2021US 2021/0009759 A1Elite Electronic Material (Kunshan) Co., Ltd.
- High strength rubber composition30 Jan 2020US 2020/0031980 A1Compagnie Generale Des Etablissements Michelin
- Epoxy resin composition and cured product thereof9 Nov 2017US 2017/0320994 A1DIC Corporation
- Resin composition for printed circuit board, prepreg, resin composite sheet and metal foil clad laminate17 Aug 2017US 2017/0238418 A1Mitsubishi Gas Chemical Company, Inc.
Most cited
By later US patents