Resin composition for printed circuit board, prepreg, resin composite sheet and metal foil clad laminate
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsTakashi Kobayashi, Kentaro Takano
Life of this patent
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Abstract
The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).
Claims11
A resin composition for a printed circuit board, comprising a cyanate ester compound (A) having at least one structure selected from the group consisting of structures represented by the following formula (1), the following formula (2) and the following formula (8), and an epoxy resin (B):
- wherein k represents an integer of 1 or more, and l represents an integer of 0 or more, the cyanate ester compound optionally being a mixture of compounds different in k and l, and arrangement of repeating units being arbitrary,
- wherein m and n each represent an integer of 0 or more, at least one of m and n being 1 or more, the cyanate ester compound optionally being a mixture of compounds different in m and n, and arrangement of repeating units being arbitrary, and
- wherein m represents an integer of 0 or more, and the cyanate ester compound being a mixture of compounds different in m.
Dependencies are inferred from the claim text.