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US 11,370,885 B2Granted
Resin composition and article made therefrom
AssigneeElite Electronic Material (Kunshan) Co., Ltd.
InventorsXingxing Yao, Rongtao Wang, Ningning Jia
Life of this patent
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Abstract
A resin composition comprises a prepolymer of crosslinking agent and benzoxazine resin and a maleimide resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including laminate reflow shrinkage, T288 thermal resistance, ten-layer board T300 thermal resistance, dissipation factor, copper foil peeling strength, and resin filling property in open area.
Claims16
A resin composition, comprising:
- (A) 10 parts by weight to 45 parts by weight of a prepolymer of crosslinking agent and benzoxazine resin;
- and
- (B) 30 parts by weight to 70 parts by weight of a maleimide resin,
- wherein the prepolymer of crosslinking agent and benzoxazine resin comprises a structure of Formula (1) below:
- wherein R2 is a covalent bond, —CH2—, —CH(CH3)— or —C(CH3)2—;
- R3, R4, R5 and R6 each independently represent hydrogen or an unsaturated bond-containing group, and R3, R4, R5 and R6 are not hydrogen at the same time;
- and m is an integer of 1 to 10.
4 more elements
Dependencies are inferred from the claim text.