Epoxy resin composition and cured product thereof
AssigneeDIC Corporation
InventorsKazuo Arita, Tatsuya Okamoto, Kazuhisa Yamoto, Yutaka Sato
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Abstract
A triazine ring-containing phenol resin obtained by reacting melamine, para-alkylphenol, and formalin is used to provide an epoxy resin composition capable of providing a cured product with excellent flame retardancy, excellent dielectric characteristics such as a low dielectric tangent and a low dielectric constant, and excellent thermal conductivity, a cured product thereof, and a prepreg, a circuit board, a build-up film, a build-up board, a semiconductor sealing material, a semiconductor device, a fiber reinforced composite material, and a formed article using the epoxy resin composition.
Claims9
A triazine ring-containing phenol resin comprising:
- a structural site α represented by the following Structural Formula (I) and a structural site β represented by the following Structural Formula (II), as repeating structural units:
- wherein R represents an alkyl group having 1 to 6 carbon atoms.
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Dependencies are inferred from the claim text.