C08J 2363/04
Epoxynovolacs
C08J2363/04 (Epoxynovolacs) appears on 105 US grants and 167 published applications in this corpus.
Search patents in C08J- Granted patents
- 105
- Published applications
- 167
- Assignees
- 69
- Inventors
- 353
- Latest grant
- 13 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 2 |
| 2011 | 2 | 1 |
| 2012 | 0 | 3 |
| 2013 | 0 | 5 |
| 2014 | 1 | 6 |
| 2015 | 1 | 12 |
| 2016 | 5 | 20 |
| 2017 | 11 | 29 |
| 2018 | 15 | 18 |
| 2019 | 20 | 15 |
| 2020 | 13 | 12 |
| 2021 | 12 | 14 |
| 2022 | 14 | 7 |
| 2023 | 3 | 3 |
| 2024 | 5 | 7 |
| 2025 | 2 | 6 |
| 2026 | 1 | 6 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Epoxy resin, epoxy compound, epoxy resin composition, resin sheet, prepreg, carbon fiber reinforced composite material and phenol resin13 Jan 2026US 12,522,690 B2Nippon Kayaku Kabushiki Kaisha
- Flame retardant masterbatch composition for foams containing a pH moderator29 Apr 2025US 12,286,520 B2Ddp Specialty Electronic Materials US, LLC
- Curable epoxy composition and its use in prepregs and core filling11 Mar 2025US 12,247,121 B2Von Roll Schweiz AG
- Fast-cure resin formulations with consistent handling characteristics12 Nov 2024US 12,139,575 B2Cytec Industries Inc.
- Resin composition, prepreg containing same, laminate, and printed circuit board1 Oct 2024US 12,104,054 B2Shengyi Technology Co., Ltd.
- Magnetic composition, magnetic film, stack, and circuit member1 Oct 2026US 2026/0297291 A1
- Prepreg, fiber-reinforced composite material, tubular body made of fiber-reinforced composite material, golf club shaft, and fishing rod27 Aug 2026US 2026/0250459 A1Toray Industries, Inc.
- Easily dismantlable resin composition for fixing rotor and dismantling method for rotor27 Aug 2026US 2026/0250479 A1Sumitomo Bakelite Co., Ltd.
- Easily dismantlable resin composition, structural body including cured product of easily dismantlable resin composition, dismantling method for structural body, and recycling method for material constituting structural body27 Aug 2026US 2026/0250481 A1Sumitomo Bakelite Co., Ltd.
- One-component expandable thermosetting epoxy composition with reduced voc emission30 Jul 2026US 2026/0217319 A1Sika Technology AG
Most cited
By later US patents
- Halogen free resin composition and prepreg and laminated board prepared therefrom6US 10,144,824 B2Shengyi Technology Co., Ltd. · 2018
- Process for epoxy foam production4US 8,003,730 B1Sandia Corporation · 2011
- Peel ply, method of surface preparation and bonding composite structures using the same3US 9,473,459 B2Cytec Technology Corp. · 2016
- Bonding of composite materials3US 9,636,867 B2Cytec Industries Inc. · 2017
- Halogen-free epoxy resin composition, prepreg and laminate using same3US 9,873,789 B2Shengyi Technology Co., Ltd. · 2018