Halogen-free epoxy resin composition, prepreg and laminate using same
AssigneeShengyi Technology Co., Ltd.
InventorsXianping Zeng, Liexiang He
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Abstract
Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.
Claims24
A halogen-free epoxy resin composition, comprising
- (A) a halogen-free epoxy resin;
- (B) a crosslinking agent;
- and
- (C) a phosphorous-containing novolac resin having the following structure
- A and A1 are both dependently
- p, q, m and n represent the numbers of repeating units and are independently integers which are greater than or equal to 1;
- X is 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or derivatives thereof;
- R is selected from the group consisting of hydrogen, aliphatic functional groups or aromatic functional groups.
Dependencies are inferred from the claim text.