One-component expandable thermosetting epoxy composition with reduced voc emission
AssigneeSika Technology AG
InventorsPhilip Horst CASPARI, Noah MUNZINGER
Life of this patent
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Abstract
A one-component thermosetting epoxy resin composition, including an epoxy resin A having on average more than one epoxide group per molecule, a latent hardener for epoxy resins, a physical or chemical blowing agent BA and at least one copolymer CP including ethylene monomer residues and residues of a first comonomer having one or more functionalities selected from the group including of carboxylic acid and salts thereof, carboxylic acid anhydride and epoxide. The epoxy resin adhesive is notable for low VOC content after full curing, especially around 200° C. for 30 min.
Claims17
A one-component thermosetting epoxy resin composition, comprising
- a) at least one epoxy resin A having on average more than one epoxide group per molecule;
- b) at least one latent hardener for epoxy resins;
- and
- c) at least one physical or chemical blowing agent BA;
- and
- d) at least one copolymer CP comprising ethylene monomer residues and residues of a first comonomer having one or more functionalities selected from the group wherein the at least one copolymer CP is contained in an amount from 1-10 wt-%, based on the total weight of the one-component thermosetting epoxy resin composition.
(canceled)
Dependencies are inferred from the claim text.