Resin composition, prepreg containing same, laminate, and printed circuit board
AssigneeShengyi Technology Co., Ltd.
InventorsLiexiang He, Yongnian Qi, Xianping Zeng, Zhongqiang Yang, Hualin Pan
Life of this patent
Estimating the term…
Abstract
The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.
Claims10
A resin composition, comprising:
- 100 parts by weight of a halogen-free epoxy resin,
- 11-37 parts by weight of an active ester resin, and
- 40-66 parts by weight of a compound represented by Formula (I),
- wherein n is 2-15;
- Ac represents an acetyl group;
- wherein the active ester resin is a compound represented by Formula (II)
- wherein X represents a phenyl group or a naphthyl group;
- j is 0 or 1;
- k is 0 or 1;
- n is 0.25-1.25;
- wherein the active ester resin has a number average molecular weight of less than 800.
Dependencies are inferred from the claim text.