C08G 59/5033
Aromatic
Official title: {aromatic}
C08G59/5033 (Aromatic) appears on 429 US grants and 548 published applications in this corpus.
Search patents in C08G- Granted patents
- 429
- Published applications
- 548
- Assignees
- 253
- Inventors
- 1,239
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 5 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 6 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 4 | 0 |
| 1988 | 7 | 0 |
| 1989 | 5 | 0 |
| 1990 | 7 | 0 |
| 1991 | 7 | 0 |
| 1992 | 7 | 0 |
| 1993 | 6 | 0 |
| 1994 | 4 | 0 |
| 1995 | 7 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 1 |
| 2002 | 5 | 3 |
| 2003 | 7 | 7 |
| 2004 | 5 | 12 |
| 2005 | 3 | 5 |
| 2006 | 5 | 6 |
| 2007 | 4 | 7 |
| 2008 | 3 | 8 |
| 2009 | 2 | 7 |
| 2010 | 7 | 19 |
| 2011 | 12 | 16 |
| 2012 | 6 | 10 |
| 2013 | 4 | 14 |
| 2014 | 9 | 12 |
| 2015 | 7 | 25 |
| 2016 | 15 | 32 |
| 2017 | 21 | 37 |
| 2018 | 17 | 25 |
| 2019 | 27 | 37 |
| 2020 | 27 | 42 |
| 2021 | 23 | 47 |
| 2022 | 29 | 37 |
| 2023 | 27 | 33 |
| 2024 | 16 | 36 |
| 2025 | 24 | 43 |
| 2026 | 19 | 27 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Epoxy resin curing agent, epoxy resin composition, and paint6 Oct 2026US 12,753,270 B2Mitsubishi Gas Chemical Company, Inc.
- Coating compositions30 Jun 2026US 12,668,715 B2PRC-DeSoto International, Inc.
- Epoxy resin16 Jun 2026US 12,655,248 B2Commonwealth Scientific and Industrial Research Organisation
- High compressive strength polymer grout and method of making26 May 2026US 12,637,390 B2Five Star Products, Inc.
- Epoxy resin composition, prepreg, fiber-reinforced resin molded body, and integrated product26 May 2026US 12,637,536 B2Toray Industries, Inc.
- Coating compositions17 Sep 2026US 2026/0275153 A1PRC-DeSoto International, Inc.
- Phosphonate epoxy thermosets27 Aug 2026US 2026/0250458 A1
- A method of curing an epoxide and use of the cured epoxide13 Aug 2026US 2026/0234321 A1Aditya Birla Chemicals (Thailand) Ltd.
- Curable heat-conductive adhesive agent6 Aug 2026US 2026/0226324 A1Sekisui Chemical Co., Ltd.
- Curable thermally conductive adhesive and thermally conductive member6 Aug 2026US 2026/0226325 A1Sekisui Chemical Co., Ltd.
Most cited
By later US patents
- Epoxy resin composition and well treatment method102US 5,609,207 AHalliburton Company · 1997
- Epoxy resin curing agent, process, and composition96US 4,684,678 AMinnesota Mining and Manufacturing Company · 1987
- Epoxy resin composition and well treatment method62US 5,559,086 AHalliburton Company · 1996
- Polymerization products containing amino groups useful in serum cholesterol level control54US 3,980,770 APharmacia Aktiebolag · 1976
- Binder resin for resin transfer molding preforms46US 5,369,192 AMinnesota Mining and Manufacturing Company · 1994