Curable thermally conductive adhesive and thermally conductive member
AssigneeSekisui Chemical Co., Ltd.
InventorsAtsushi FURUKAWA, Tatsuya IWAMOTO, Yusuke KOBAYASHI, Tetsuro YOSHIOKA
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Abstract
A curable thermally conductive adhesive comprising a curable binder and a thermally conductive filler, wherein a cured product of the curable thermally conductive adhesive has a mass loss rate of 1.5% or less after a thermal cycling test wherein a cycle consisting of 3 hours at −40° C. and 3 hours at 80° C. is repeated 20 times, and an elastic modulus at 80° C. of 1.2×108 Pa or less.
Claims17
A curable thermally conductive adhesive comprising a curable binder and a thermally conductive filler,
- a cured product of the curable thermally conductive adhesive having a mass loss rate of 1.5% or less after a thermal cycling test in which 3 hours at −40° C. and 3 hours at 80° C. are repeated 20 times, and an elastic modulus determined with a dynamic viscoelasticity analyzer at 80° C. of 1.2×108 Pa or less,
- wherein the binder comprises at least one selected from a group consisting of a urethane-based binder, an epoxy-based binder, an acryl-based binder, and an organic polymer having a hydrolyzable silyl group, and
- the binder comprises an epoxy group-containing compound and at least one of an amine or a thiol in a case where the binder comprises an epoxy-based binder, and
- an equivalent ratio of the number of active hydrogen atoms of amino group contained in the amine to the number of epoxy groups of the epoxy group-containing compound [(the number active hydrogen atoms of amino groups)/the number of epoxy groups] is 1.36 or more and 2.9 or less in a case where the binder comprises the amine.
A thermally conductive member comprising a polymer matrix and a thermally conductive filler, and having a mass loss rate of 1.5% or less after a thermal cycling test in which 3 hours at −40° C. and 3 hours at 80° C. are repeated 20 times, and an elastic modulus determined with a dynamic viscoelasticity analyzer at 80° C. of 1.2×108 Pa or less,
- wherein the polymer matrix comprises at least one selected from a group consisting of a cured product of an epoxy resin, a cured product of an acryl resin, and a cured product of an organic polymer having a hydrolyzable silyl group,
- the polymer matrix comprises an epoxy group-containing compound and at least one of an amine or a thiol in a case where the polymer matrix comprises a cured product of an epoxy resin, and
- an equivalent ratio of the number of active hydrogen atoms of amino group contained in the amine to the number of epoxy groups of the epoxy group-containing compound [(the number of the active hydrogen atoms of amino groups)/the number of epoxy groups] is 1.36 or more and 2.9 or less in a case where the polymer matrix comprises the amine.
Dependencies are inferred from the claim text.